Stacked modules and method
US7719098B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 16, 2007 |
| Grant date | May 18, 2010 |
| Priority date | — |
| Expiry date | Mar 27, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/5327
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention stacks integrated circuits into modules that conserve board surface area. In a precursor assembly devised as a component for a stacked circuit module in accordance with a preferred embodiment of the present invention, one or more stiffeners are disposed at least partially between a flex circuit and an integrated circuit. In a two-high stacked circuit module devised in accordance with a preferred embodiment of the present invention, an integrated circuit is stacked above a precursor assembly. The two integrated circuits are connected with the flex circuit of the precursor assembly. The present invention may be employed to advantage in numerous configurations and combinations of integrated circuits in modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.