Surface inspection method and surface inspection apparatus
US7719669B2 · kind B2 · utility
7Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2007 |
| Grant date | May 18, 2010 |
| Priority date | — |
| Expiry date | Apr 16, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Light from a light source becomes two illumination beams by a beam splitter. The beams are irradiated onto a semiconductor wafer from two mutually substantially orthogonal azimuthal angles having substantially equal elevation angles to form illumination spots. When the sum of scattered, diffracted, and reflected lights due to the illumination beams is detected, influence of the anisotropy which a contaminant particle and a defect existing in the wafer itself or thereon have with respect to an illumination direction, can be eliminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.