Gas distribution system for improved transient phase deposition

US7722737B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Sudhir Gondhalekar · Pleasanton, US
• Robert Duncan · Cayce, US
• Siamak Salimian · Sunnyvale, US
• Muhammad M. Rasheed · San Jose, US
• Harry Whitesell · Sunnyvale, US
• Bruno Geoffrion · South San Francisco, US
• Padmanabhan Krishnaraj · San Francisco, US
• Rudolf Gujer · Saratoga, US

Key dates

• Filing date: May 4, 2005
• Grant date: May 25, 2010
• Expiry date: Aug 31, 2026

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23C16/4558
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Embodiments of the present invention are directed to a gas distribution system which distributes the gas more uniformly into a process chamber. In one embodiment, a gas distribution system comprises a gas ring including an outer surface and an inner surface, and a gas inlet disposed at the outer surface of the gas ring. The gas inlet is fluidicly coupled with a first channel which is disposed between the outer surface and the inner surface of the gas ring. A plurality of gas outlets are distributed over the inner surface of the gas ring, and are fluidicly coupled with a second channel which is disposed between the outer surface and the inner surface of the gas ring. A plurality of orifices are fluidicly coupled between the first channel and the second channel. The plurality of orifices are spaced from the gas inlet by a plurality of distances, and have sizes which vary with the distances from the gas inlet as measured along the first channel, such that the size of the orifice increases with an increase in the distance between the orifice and the gas inlet as measured along the first channel.