Patent · US Active

Direct-write wafer level chip scale package

US7723210B2 · kind B2 · utility

31Cited by

332References

14Claims

0Family size

Assignee

Amkor Technology, Inc. · US

Inventors

Christopher J. Berry · Aiken, US
Ronald Patrick Huemoeller · Chandler, US
David Jon Hiner · Chandler, US

Key dates

Filing date	Jun 6, 2007
Grant date	May 25, 2010
Priority date	—
Expiry date	Dec 30, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/14
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method and structure provides a Direct Write Wafer Level Chip Scale Package (DWWLCSP) that utilizes permanent layers/coatings and direct write techniques to pattern these layers/coatings, thereby avoiding the use of photoimagable materials and photo-etching processes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.