Inventor · Aiken, SC, US

Christopher J. Berry

36Patents
14h-index
22Co-inventors
81Inventor score

Filing activity: Oct 4, 1999 → Jul 18, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US7777351B1 Thin stacked interposer package Electricity 347 Active
US8319338B1 Thin stacked interposer package Electricity 130 Active
US7342303B1 Semiconductor device having RF shielding and method therefor Electricity 102 Expired
US7745910B1 Semiconductor device having RF shielding and method therefor Electricity 84 Active
US7898066B1 Semiconductor device having EMI shielding and method therefor Electricity 46 Active
US8188584B1 Direct-write wafer level chip scale package Electricity 39 Active
US7687899B1 Dual laminate package structure with embedded elements Electricity 36 Active
US7723210B2 Direct-write wafer level chip scale package Electricity 31 Active
US7507603B1 Etch singulated semiconductor package Electricity 28 Expired
US6277431A Anticholesterolemic edible oil Human Necessities 25 Expired
US7872343B1 Dual laminate package structure with embedded elements Electricity 25 Active
US7781852B1 Membrane die attach circuit element package and method therefor Electricity 24 Active
US7472747B1 Biological enhancement of hydrocarbon extraction Emerging Cross-Sectional Technologies 23 Active
US7829990B1 Stackable semiconductor package including laminate interposer Electricity 15 Active
US9466545B1 Semiconductor package in package Electricity 14 Active
US8283767B1 Dual laminate package structure with embedded elements Electricity 14 Active
US8501543B1 Direct-write wafer level chip scale package Electricity 11 Active
US9711485B1 Thin bonded interposer package Electricity 9 Active
US8299610B1 Semiconductor device having RF shielding and method therefor Electricity 8 Active
US7732899B1 Etch singulated semiconductor package Electricity 7 Active
US7859116B1 Exposed metal bezel for use in sensor devices and method therefor Electricity 7 Active
US9875980B2 Copper pillar sidewall protection Electricity 4 Active
US9768124B2 Semiconductor package in package Electricity 4 Active
US8365611B1 Bend test method and apparatus for flip chip devices Physics 2 Active
US10446455B2 Fingerprint sensor and manufacturing method thereof Electricity 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.