Method of making electronic entities

US7724359B2 · kind B2 · utility

Assignee

• Agere Systems Inc. · US

Inventors

• Ahmed Amin · Allentown, US
• Mark A. Bachman · Sinking Spring, US
• Frank Baiocchi · Allentown, US
• John M. DeLucca · Wayne, US
• John W. Osenbach · Kutztown, US

Key dates

• Filing date: May 27, 2008
• Grant date: May 25, 2010
• Expiry date: Jun 18, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Many electronic entities such as integrated circuits and discrete power devices have contact pads formed from successively deposited layers of nickel and a second metal such as gold. The resulting pad structure is used to make external electrical connection such as solder connection. Problems associated with failure of such connections are avoidable by inspecting the surface of the nickel layer for excessive small particle formation.