Inventor · Sinking Spring, PA, US

Mark A. Bachman

19Patents
7h-index
16Co-inventors
59Inventor score

Filing activity: Sep 30, 2003 → Jun 3, 2014

Most-cited inventions

PatentTitleAreaCited byStatus
US8492911B2 Stacked interconnect heat sink Electricity 26 Active
US8987137B2 Method of fabrication of through-substrate vias Electricity 24 Active
US7952206B2 Solder bump structure for flip chip semiconductor devices and method of manufacture therefore Electricity 14 Active
US7328830B2 Structure and method for bonding to copper interconnect structures Electricity 12 Expired
US8742535B2 Integration of shallow trench isolation and through-substrate vias into integrated circuit designs Electricity 11 Active
US8378485B2 Solder interconnect by addition of copper Electricity 10 Active
US8319343B2 Routing under bond pad for the replacement of an interconnect layer Electricity 9 Active
US7777333B2 Structure and method for fabricating flip chip devices Electricity 7 Expired
US6960836B2 Reinforced bond pad Electricity 6 Expired
US7221173B2 Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process Electricity 3 Expired
US7671436B2 Electronic packages Electricity 2 Active
US7479695B2 Low thermal resistance assembly for flip chip applications Electricity 2 Active
US8507317B2 Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore Electricity 2 Active
US9613847B2 Integration of shallow trench isolation and through-substrate vias into integrated circuit designs Electricity 2 Active
US8779587B2 PB-free solder bumps with improved mechanical properties Electricity 1 Active
US7724359B2 Method of making electronic entities Electricity 1 Active
US8580621B2 Solder interconnect by addition of copper Electricity 1 Active
US9054064B2 Stacked interconnect heat sink Electricity 0 Active
US9443821B2 Pb-free solder bumps with improved mechanical properties Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.