Thin multi-chip flex module
US7724530B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2008 |
| Grant date | May 25, 2010 |
| Priority date | — |
| Expiry date | Dec 30, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49179
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.