Process for selective masking of III-N layers and for the preparation of free-standing III-N layers or of devices, and products obtained thereby

US7727332B2 · kind B2 · utility

Assignee

• FREIBERGER COMPOUND MATERIALS GMBH · DE

Inventors

• Frank Habel · Freiberg, DE
• Ferdinand Scholz · Ulm, DE
• Barbara Neubert · Ulm, DE
• Peter Brückner · Gundelfingen, DE
• Thomas Wunderer · Palo Alto, US

Key dates

• Filing date: Dec 21, 2006
• Grant date: Jun 1, 2010
• Expiry date: Oct 14, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/02647
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

In a process for forming a mask material on a III-N layer, wherein III denotes an element of the group III of the Periodic Table of Elements, selected from Al, Ga and In, a III-N layer having a surface is provided which comprises more than one facet. Mask material is selectively deposited only on one or multiple, but not on all facets. The deposition of mask material may be particularly carried out during epitaxial growth of a III-N layer under growth conditions, by which (i) growth of at least a further III-N layer selectively on a first type or a first group of facet(s) and (ii) a deposition of mask material selectively on a second type or a second group of facet(s) proceed simultaneously. By the process according to the invention, it is possible to produce free-standing thick III-N layers. Further, semiconductor devices or components having special structures and layers can be produced.