Step and repeat imprint lithography processes
US7727453B2 · kind B2 · utility
11Cited by
189References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 11, 2005 |
| Grant date | Jun 1, 2010 |
| Priority date | — |
| Expiry date | Jun 22, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The present invention is directed to a method of forming a layer on a region of a substrate, the method including, inter alia, positioning a liquid on the substrate; and contacting the liquid with the mold, defining a gap between the mold and the substrate, with the gap enabling positioning of the liquid by capillary forces to generate the layer over the region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.