Patent · US Active

Method for making a device including placing a semiconductor chip on a substrate

US7727813B2 · kind B2 · utility

7Cited by

10References

10Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Ralf Otremba · Kaufbeuren, DE
Xaver Schloegel · Sachsenkam, DE
Rupert Fischer · Maxhütte-Haidhof, DE
Tien Lai Tan · Melaka City, MY

Key dates

Filing date	Nov 26, 2007
Grant date	Jun 1, 2010
Priority date	—
Expiry date	Feb 15, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19043
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for making a device is disclosed. One embodiment provides a substrate having a first element protruding from the substrate. A semiconductor chip has a first electrode on a first surface and a second electrode on a second surface opposite to the first surface. The semiconductor chip is placed over the first element of the substrate with the first surface of the semiconductor chip facing the substrate. The second electrode of the semiconductor chip is electrically coupled to the substrate, and the substrate is at least partially removed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.