Integrated circuit, method for manufacturing an integrated circuit, memory cell array, memory module, and device
US7732888B2 · kind B2 · utility
0Cited by
6References
28Claims
0Family size
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Key dates
| Filing date | Apr 16, 2007 |
| Grant date | Jun 8, 2010 |
| Priority date | — |
| Expiry date | Apr 18, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/90
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
According to one embodiment of the present invention, a memory cell array comprises a plurality of voids, the spatial positions and dimensions of the voids being chosen such that mechanical stress occurring within the memory cell array is at least partly compensated by the voids.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.