Substrate processing method and apparatus
US7735451B2 · kind B2 · utility
0Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2003 |
| Grant date | Jun 15, 2010 |
| Priority date | — |
| Expiry date | Jun 22, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/901
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.