Optical die-down quad flat non-leaded package

US7736930B2 · kind B2 · utility

Assignee

• STATS ChipPAC, Ltd. · SG

Inventor

• Jonathan Abela · Grenoble, FR

Key dates

• Filing date: Jan 14, 2009
• Grant date: Jun 15, 2010
• Expiry date: Jan 14, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/00014

Abstract

An optical sensor package that includes an optical sensor die is mounted by flip chip interconnect onto a lead frame in a “die-down” orientation, that is, with the active side of the optical sensor die facing the lead frame. An opening is provided in the lead frame die paddle (pad), and light passes from outside the package through the opening in the lead frame die pad onto light collection elements on the active side of the chip.