Patent · US Active

Method for forming a structure on a substrate and device

US7737049B2 · kind B2 · utility

2Cited by

23References

23Claims

0Family size

Assignee

Qimonda AG · DE

Inventors

Dirk Manger · Dresden, DE
Stephan Wege · Osterburken, DE
Rolf Weis · Dresden, DE
Christoph Noelscher · Nuremberg, DE

Key dates

Filing date	Jul 31, 2007
Grant date	Jun 15, 2010
Priority date	—
Expiry date	Nov 16, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/32139
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In one aspect, a method of forming a structure on a substrate is disclosed. For example, the method includes forming a first mask layer and a second mask layer, modifying a material property in regions of the first and second mask layers, and forming the structure based on the modified regions.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.