Integrated circuit package system including honeycomb molding
US7737539B2 · kind B2 · utility
21Cited by
12References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2006 |
| Grant date | Jun 15, 2010 |
| Priority date | — |
| Expiry date | Jan 12, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package system including a substrate with a top surface and a bottom surface. Configuring the top surface to include electrical contacts formed between a perimeter of the substrate and a semiconductor die. Aligning over the top surface of the substrate a mold plate with a honeycomb meshwork of posts or a stepped honeycomb meshwork of posts and depositing a material to prevent warpage of the substrate between the top surface of the substrate and the mold plate. Removing the mold plate to reveal discrete hollow conduits formed within the material that align with the electrical contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.