Apparatus for wafer level arc detection at an electrostatic chuck electrode
US7737702B2 · kind B2 · utility
32Cited by
12References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 15, 2007 |
| Grant date | Jun 15, 2010 |
| Priority date | — |
| Expiry date | Feb 28, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Wafer level arc detection is provided in a plasma reactor using an RF transient sensor sensing voltage at an electrostatic chucking electrode, the RF sensor being coupled to a threshold comparator, and a system controller responsive to the threshold comparator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.