Method of producing an overmolded electronic module with a flexible circuit pigtail
US7739791B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2007 |
| Grant date | Jun 22, 2010 |
| Priority date | — |
| Expiry date | Oct 26, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/5193
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of producing an overmolded electronic assembly including a circuit board and a flexible circuit interconnect by fixturing the assembly in a mold cavity such that a portion of the flexible circuit protrudes from the mold, and providing a compressible elastomeric interface between the mold and the flexible circuit to seal off the mold cavity and protect the flexible circuit from damage due to the clamping force of the mold. The portion of the flexible circuit within the mold cavity is pre-coated with a material that ensures good adhesion with the molding compound, and a heat exchanger thermally coupled to the portion of the flexible circuit that protrudes from the mold protects the flexible circuit from damage due to thermal conduction from the mold and mold compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.