Exhaust apparatus configured to reduce particle contamination in a deposition system
US7740705B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 8, 2006 |
| Grant date | Jun 22, 2010 |
| Priority date | — |
| Expiry date | Apr 21, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/4412
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and system for vapor deposition on a substrate that disposes a substrate in a process space of a processing system that is isolated from a transfer space of the processing system, processes the substrate at either of a first position or a second position in the process space while maintaining isolation from the transfer space, and deposits a material on said substrate at either the first position or the second position. Furthermore, the system includes a high conductance exhaust apparatus configured to be coupled to the process space, whereby particle contamination of the substrate processed in the deposition system is minimized. The exhaust apparatus comprises a pumping system located above the substrate and an evacuation duct, wherein the evacuation duct has an inlet located below the substrate plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.