Patent · US Active

Leadframe and mold compound interlock in packaged semiconductor device

US7741704B2 · kind B2 · utility

11Cited by

4References

5Claims

0Family size

Assignees

TEXAS INSTRUMENTS INCORPORATED · US
TEXAS INSTRUMENTS DEUTSCHLAND GMBH · DE

Inventors

Bernhard Lange · Gerolzhofen, DE
Steven Kummerl · Carrollton, US

Key dates

Filing date	Oct 18, 2007
Grant date	Jun 22, 2010
Priority date	—
Expiry date	Nov 27, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/18301
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An interference interlock between leadframe features and a mold compound is provided in a packaged semiconductor device by exposing at least one predetermined surface area to an etching process prior to a molding step. This produces an etched recess with a recessed wall delimited by a step wall, generally perpendicular and adjacent to the recessed wall. The step wall is partially undercut by etching. During the molding step, the recessed wall and the step wall are both contacted by and embedded in the molding compound.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.