Integrated circuit system with dummy region
US7741719B2 · kind B2 · utility
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4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2008 |
| Grant date | Jun 22, 2010 |
| Priority date | — |
| Expiry date | Jan 3, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/926
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit system comprised by forming a first region, a second region and a third region within a dielectric over a substrate. The first region includes tungsten plugs. The second region is formed adjacent at least a portion of the perimeter of the first region and the third region is formed between the first region and the second region. An opening is formed in the third region and a material is deposited within the opening for preventing erosion of the first region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.