Patent · US Active

Method for the structured application of a laminatable film to a substrate for a semiconductor module

US7742843B2 · kind B2 · utility

1Cited by

12References

22Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thomas Licht · Warstein, DE
Alfred Kemper · Warstein, DE

Key dates

Filing date	Oct 12, 2006
Grant date	Jun 22, 2010
Priority date	—
Expiry date	Jun 28, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1311
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for structured application of a laminatable intermediate layer (9) to a substrate (1) for a semiconductor module, wherein a separating layer is indirectly or directly applied to the substrate (1) over a large surface, the intermediate layer (9) is applied to the substrate (1), including the separating layer(s), by lamination, over a large surface, the intermediate layer (9) is opened in places on the substrate (1), where recesses are provided for the intermediate layer (9), and the separating layer (8) is removed in these places.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.