Reduced contaminant gas injection system and method of using
US7743731B2 · kind B2 · utility
2Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2006 |
| Grant date | Jun 29, 2010 |
| Priority date | — |
| Expiry date | Jul 13, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67069
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A gas injection system includes a diffuser to distribute a process gas in a processing chamber. The gas injection system may be utilized in a polysilicon etching system involving corrosive process gases.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.