Polishing apparatus and polishing method
US7744445B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 12, 2005 |
| Grant date | Jun 29, 2010 |
| Priority date | — |
| Expiry date | Jul 20, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B21/002
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus has a polishing tape (21), a supply reel (22) for supplying the polishing tape (21) to a contact portion (30) at which the polishing tape (21) is brought into contact with a notch portion (11) of a substrate (10), and a take-up reel (23) for winding up the polishing tape (21) from the contact portion (30). The polishing apparatus also has a first guide portion (24) having as guide surface (241) for supplying the polishing tape (21) directly to the contact portion (30), and a second guide portion (25) having a guide surface for supplying the polishing tape (21) tot the take-up reel (23). The guide surface (241) of the first guide portion (24) and/or the guide surface of the second guide portion (25) has a shape corresponding to a shape of the notch portion (11) of the substrate (10).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.