Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same
US7745932B2 · kind B2 · utility
6Cited by
5References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 2008 |
| Grant date | Jun 29, 2010 |
| Priority date | — |
| Expiry date | Jun 2, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are a semiconductor package and a semiconductor package module including the same. The semiconductor package may include a plurality of semiconductor chips, a plurality of leads connected to pads of the semiconductor chips and externally exposed, wherein the plurality of leads may be classified into a plurality of pin groups, and the plurality of semiconductor chips may be classified into a plurality of chip groups, and the pads of the semiconductor chips of like chip groups may be connected to the leads of like pin groups.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.