Methods, defect review tools, and systems for locating a defect in a defect review process
US7747062B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2005 |
| Grant date | Jun 29, 2010 |
| Priority date | — |
| Expiry date | Sep 12, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods, defect review tools, and systems for locating a defect in a defect review process are provided. One method includes acquiring one or more images and data from an inspection tool. The one or more images illustrate an area on a specimen in which a defect to be reviewed is located. The data indicates a position and features of the defect within the area. The method also includes acquiring one or more additional images of the specimen proximate the position of the defect indicated in the data using an imaging subsystem of a defect review tool. In addition, the method includes identifying a portion of the one or more additional images that corresponds to the one or more images. The method further includes determining a position of the defect within the portion of the one or more additional images using the data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.