Polishing pad conditioning process
US7749048B2 · kind B2 · utility
1Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 4, 2007 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | May 4, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of operating a polishing apparatus in which a substrate is held with a carrier head supported by a movable support of the polishing apparatus, the substrate is brought into contact with a polishing surface at a polishing station of the polishing apparatus and the substrate is polished, the substrate is removed from the polishing surface, the support moves to transfer the carrier head to a different station of the polishing apparatus, and the polishing surface is conditioned. The conditioning overlaps with at least one of removing the substrate or moving the support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.