Method of forming an electronic device using a separation-enhancing species
US7749884B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 5, 2009 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | May 5, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming an electronic device can include forming a metallic layer by an electrochemical process over a side of a substrate that includes a semiconductor material. The method can also include introducing a separation-enhancing species into the substrate at a distance from the side, and separating a semiconductor layer and the metallic layer from the substrate, wherein the semiconductor layer is a portion of the substrate. In a particular embodiment, the separation-enhancing species can be incorporated into a metallic layer and moved into the substrate, and in particular embodiment, the separation-enhancing species can be implanted into the substrate. In still another embodiment, both the techniques can be used. In a further embodiment, a dual-sided process can be performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.