Integrated module for data processing system
US7750459B2 · kind B2 · utility
20Cited by
5References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2008 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | May 30, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for an integrated module. A silicon carrier with through-silicon vias has a plurality of die connected to a top side of the silicon carrier. In addition, a substrate is connected to a bottom side of the silicon carrier. The substrate is coupled to the plurality of die via the through-silicon vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.