Inventor · Potsdam, NY, US

Cornelia K. Tsang

79Patents
12h-index
99Co-inventors
83Inventor score

Filing activity: Jul 1, 2003 → Feb 3, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US8917210B2 Package structures to improve on-chip antenna performance Electricity 184 Active
US7276787B2 Silicon chip carrier with conductive through-vias and method for fabricating same Electricity 90 Expired
US7488680B2 Conductive through via process for electronic device carriers Emerging Cross-Sectional Technologies 47 Active
US7741226B2 Optimal tungsten through wafer via and process of fabricating same Electricity 25 Active
US7518229B2 Versatile Si-based packaging with integrated passive components for mmWave applications Electricity 21 Active
US7808798B2 Versatile Si-based packaging with integrated passive components for mmWave applications Electricity 21 Active
US7750459B2 Integrated module for data processing system Electricity 20 Active
US8138036B2 Through silicon via and method of fabricating same Electricity 14 Active
US8198734B2 Silicon-on-insulator structures for through via in silicon carriers Electricity 14 Active
US9355936B2 Flattened substrate surface for substrate bonding Electricity 14 Active
US7645701B2 Silicon-on-insulator structures for through via in silicon carriers Electricity 13 Active
US9159602B2 Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers Electricity 13 Active
US7060624B2 Deep filled vias Electricity 12 Expired
US7678696B2 Method of making through wafer vias Electricity 12 Active
US9472859B2 Integration of area efficient antennas for phased array or wafer scale array antenna applications Electricity 12 Active
US8263497B2 High-yield method of exposing and contacting through-silicon vias Electricity 11 Active
US7435627B2 Techniques for providing decoupling capacitance Electricity 11 Active
US9313921B2 Chip stack structures that implement two-phase cooling with radial flow Electricity 10 Active
US8617689B2 Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed Emerging Cross-Sectional Technologies 8 Active
US9472789B2 Thin, flexible microsystem with integrated energy source Emerging Cross-Sectional Technologies 8 Active
US8419895B2 Laser ablation for integrated circuit fabrication Emerging Cross-Sectional Technologies 7 Active
US7683478B2 Hermetic seal and reliable bonding structures for 3D applications Electricity 7 Active
US7488624B2 Techniques for providing decoupling capacitance Electricity 6 Active
US9324601B1 Low temperature adhesive resins for wafer bonding Electricity 6 Active
US8012796B2 Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers Electricity 6 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.