Packaged integrated circuit
US7750465B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2007 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Jun 10, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged integrated circuit has an integrated circuit over a support structure. A plurality of bond wires connected between active terminals of the integrated circuit and the support structure. An encapsulant overlies the support structure, the integrated circuit, and the bond wires. The encapsulant has a first open location in the encapsulant so that a first bond wire is exposed and a second open location in the encapsulant so that a second bond wire is exposed. First and second conductive structures are exposed outside the packaged integrated circuit and are located at the first and second open locations, respectively, and electrically connected to the first and second bond wires, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.