Method of applying the analysis of scrub mark morphology and location to the evaluation and correction of semiconductor testing, analysis and manufacture
US7750622B2 · kind B2 · utility
2Cited by
11References
28Claims
0Family size
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Key dates
| Filing date | Jun 29, 2006 |
| Grant date | Jul 6, 2010 |
| Priority date | — |
| Expiry date | Jun 29, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2886
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
By examining scrub mark properties (such as position and size) directly, the performance of a wafer probing process may be evaluated. Scrub mark images are captured, image data measured, and detailed information about the process is extracted through analysis. The information may then be used to troubleshoot, improve, and monitor the probing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.