Wafer level test probe card

US7750651B2 · kind B2 · utility

Assignee

• TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

• Clinton Chao · Baoshan, TW
• Fei-Chieh Yang · Baoshan, TW
• Chun-Hsing Chen · Cukeng, TW
• Mill-Jer Wang · Hsinchu, TW
• Sheng-Hsi Huang · Hsinchu, TW
• Ming-Cheng Hsu · Taipei, TW

Key dates

• Filing date: Jun 3, 2008
• Grant date: Jul 6, 2010
• Expiry date: Jun 4, 2028

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49222
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A probe card for wafer level testing of a plurality of semiconductor devices simultaneously. The probe card may include a circuit board including wafer level testing circuitry, a partially flexible silicon substrate, a plurality of test probes disposed at least partially in the substrate for engaging a plurality of corresponding electrical contacts in a wafer under test, and a compressible underfill coupling the substrate to the circuit board. The probe card may be used for wafer level burn-in testing. In some embodiments, the probe card may include active test control circuitry embedded in the silicon substrate for conducting wafer level high frequency testing.