Laminating magnetic materials in a semiconductor device
US7755124B2 · kind B2 · utility
18Cited by
3References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2006 |
| Grant date | Jul 13, 2010 |
| Priority date | — |
| Expiry date | Dec 26, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/32
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A technique includes forming overlaying magnetic metal layers over a semiconductor substrate. The technique includes forming at least one resistance layer between the magnetic metal layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.