Semiconductor package structure having enhanced thermal dissipation characteristics

US7755179B2 · kind B2 · utility

Assignee

• SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC · US

Inventors

• Francis J. Carney · Mesa, US
• Michael J. Seddon · Gilbert, US
• Kent L. Kime · Phoenix, US
• Dluong Ngan Leong · Kuala Pilah, MY
• Yeu Wen Lee · Seremban, MY

Key dates

• Filing date: Dec 20, 2004
• Grant date: Jul 13, 2010
• Expiry date: Mar 5, 2026

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

In an exemplary embodiment, a packaged device having enhanced thermal dissipation characteristics includes a semiconductor chip having a major current carrying or heat generating electrode. The semiconductor chip is oriented so that the major current carrying electrode faces the top of the package or away from the next level of assembly. The packaged device further includes a conductive clip for coupling the major current carrying electrode to a next level of assembly, and a heat spreader device formed on or integral with the conductive clip. A portion of the heat spreader device may be optionally exposed.