Substrate processing apparatus and substrate processing method
US7757626B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2006 |
| Grant date | Jul 20, 2010 |
| Priority date | — |
| Expiry date | Nov 15, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D3/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In the present invention, a holding table incorporating a heater is provided, for example, in a treatment container of a planarization unit. A pressing plate having a lower surface formed flat is disposed above the holding table. The pressing plate is movable in the vertical direction and can lower to the holding table to press a resist film on the substrate from above. The pressing plate intermittently presses the upper surface of the resist film to planarize the upper surface while the heater is heating the substrate on the holding table at a predetermined temperature to dry the resist film. According to the present invention, a coating film applied on the substrate can be sufficiently planarized and dried.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.