Patent · US Active

Semiconductor module

US7759777B2 · kind B2 · utility

17Cited by

11References

7Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Ralf Otremba · Kaufbeuren, DE
Xaver Schloegel · Sachsenkam, DE
Klaus Schiess · Allensbach, DE
Charlie Tan Tien Lai · Melaka City, MY

Key dates

Filing date	Apr 16, 2007
Grant date	Jul 20, 2010
Priority date	—
Expiry date	Feb 26, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15165
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A module having a semiconductor chip with a first contact element on a first main surface and a second contact element on a second main surface is disclosed. The semiconductor chip is arranged on a carrier. An insulating layer and a wiring layer cover the second main surface and the carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.