Grouping systematic defects with feedback from electrical inspection
US7760929B2 · kind B2 · utility
35Cited by
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10Claims
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Key dates
| Filing date | Oct 27, 2006 |
| Grant date | Jul 20, 2010 |
| Priority date | — |
| Expiry date | May 20, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F1/84
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods and apparatus for categorizing defects on workpieces, such as semiconductor wafers and masks used in lithographically writing patterns into such wafers are provided. For some embodiments, by analyzing the layout in the neighborhood of the defect, and matching it to similar defected neighborhoods in different locations across the die, defects may be categorized by common structures in which they occur.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.