Method and device for transferring a solder deposit configuration
US7762446B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 26, 2005 |
| Grant date | Jul 27, 2010 |
| Priority date | — |
| Expiry date | Sep 26, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/082
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate (36) using a removal of multiple solder deposits from a solder deposit reservoir (25) accommodated in a solder deposit receptacle unit (11) via an isolation unit (12), which is implemented like a template and is situated above the solder deposit reservoir, to implement the solder deposit configuration implemented corresponding to the terminal surface configuration, and using a subsequent transfer of the solder deposit configuration onto the terminal surface configuration of the substrate, the solder deposit reservoir being impinged by partial vacuum through template openings (15) of the isolation unit to transfer the solder deposits from the solder deposit reservoir into the isolation unit, the solder deposit reservoir (25) being ventilated via a floor wall (20) situated diametrically opposite the isolation unit during the partial vacuum impingement (27) by the isolation unit (12).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.