Apparatus for a low-cost semiconductor test interface system
US7768280B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2007 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Feb 5, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2889
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system for testing a device under test (DUT), in which electrical coupling among a module board, a low profile connector, and, a DIB is established by applying a pressure on the module board toward the DUT, is provided. The system includes a test head bracket secured inside a test head, the test head bracket includes the module board having a first section including a plurality of connectors to couple a test analyzer to the module board, a second section including a plurality of contacts pads to electrically couple the module board to the DUT, and, a flexible board to enable the first section to be placed at an angle with respect to the second section. The test head bracket also includes a module board stiffener mechanically securing the first section and the second section to the test head and the low profile connector electrically couples the module board to the DUT.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.