Methods and systems for detecting defects in a reticle design pattern
US7769225B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2005 |
| Grant date | Aug 3, 2010 |
| Priority date | — |
| Expiry date | Aug 20, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F1/84
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Computer-implemented methods and systems for detecting defects in a reticle design pattern are provided. One computer-implemented method includes acquiring images of a field in the reticle design pattern. The images illustrate how the field will be printed on a wafer at different values of one or more parameters of a wafer printing process. The field includes a first die and a second die. The method also includes detecting defects in the field based on a comparison of two or more of the images corresponding to two or more of the different values. In addition, the method includes determining if individual defects located in the first die have substantially the same within die position as individual defects located in the second die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.