Apparatus and method for measuring chuck attachment force
US7770478B2 · kind B2 · utility
3Cited by
12References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 23, 2008 |
| Grant date | Aug 10, 2010 |
| Priority date | — |
| Expiry date | Dec 23, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for measuring a chuck attachment force are provided. The apparatus is capable of measuring loads applied to a measurement substrate, while the measurement substrate is detached from a chuck, and precisely calculating necessary force through a process of comparing and analyzing values of the measured loads. This may prevent errors in the application of attachment force during a semiconductor manufacturing process. In the semiconductor manufacturing process, when the substrate is detached from a chuck, the substrate may be prevented from being deformed or cracked.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.