Method for removal of surface films from reclaim substrates
US7775856B2 · kind B2 · utility
5Cited by
12References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2007 |
| Grant date | Aug 17, 2010 |
| Priority date | — |
| Expiry date | Sep 27, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24C11/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Embodiments of the invention describe a method for reclaiming a substrate by removing surface films with media blasting. A substrate is provided having a surface film. Media blasting is performed on the substrate to remove the surface film from the surface. In one embodiment media blasting removes a film from the substrate top surface. In another embodiment media blasting removes a film from the substrate top surface and side surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.