Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates
US7776658B2 · kind B2 · utility
19Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2008 |
| Grant date | Aug 17, 2010 |
| Priority date | — |
| Expiry date | Nov 7, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package is disclosed for packaging two adjacent semiconductor dies atop a circuit substrate. The dies are separated from each other along their longitudinal edges with an inter-die distance. An elevation-adaptive electrical connection connects a top metalized contact of die two to the bottom surface of die one while accommodating for elevation difference between the surfaces. The elevation-adaptive electrical connection includes: Consequently, the semiconductor package reduces the inter-die distance from an otherwise direct transverse circuit routing between the longitudinal edges of the dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.