Patent · US Active

Conductive line comprising a capping layer

US7777266B2 · kind B2 · utility

1Cited by

0References

14Claims

0Family size

Assignee

Qimonda AG · DE

Inventors

Peter Baars · Dresden, DE
Andreas Eifler · Leipzig, DE
Klaus Muemmler · Dresden, DE
Stefan Tegen · Dresden, DE

Key dates

Filing date	Nov 29, 2007
Grant date	Aug 17, 2010
Priority date	—
Expiry date	Jul 19, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH10B12/053
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit includes a conductive line, the conductive line having a conductive layer made of a metal or a first compound including a metal and a capping layer made of a second compound comprising the metal, the capping layer being in contact with the conductive layer, the first compound being different from the second compound.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.