Heatsink apparatus for applying a specified compressive force to an integrated circuit device
US7777329B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2006 |
| Grant date | Aug 17, 2010 |
| Priority date | — |
| Expiry date | Jul 8, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus is provided having an integrated circuit device disposed on a printed circuit board and a heat dissipation device on the integrated circuit device. An actuation screw in a spring plate is urged against a portion of the heat dissipation device by tightening the actuation screw. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, a method is provided in which the actuation screw is tightened, but prevented from being tightened beyond the mechanical constraint.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.