Process using combined capacitively and inductively coupled plasma sources for controlling plasma ion radial distribution

US7780864B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Alexander Paterson · San Jose, US
• Valentin N. Todorow · Palo Alto, US
• Theodoros Panagopoulos · Los Gatos, US
• Brian K. Hatcher · San Jose, US
• Dan Katz · Calabasas, US
• Edward P. Hammond, IV · Hillsborough, US
• John Holland · San Jose, US
• Alexander Matyushkin · San Jose, US

Key dates

• Filing date: Apr 24, 2006
• Grant date: Aug 24, 2010
• Expiry date: May 8, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J37/32174
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

A method of processing a workpiece in the chamber of a plasma reactor in which the plasma ion density radial distribution in the process region is controlled by adjusting the ratio between the amounts of the (VHF) capacitively coupled power and the inductively coupled power while continuing to maintain the level of total plasma source power. The method can also include applying independently adjustable LF bias power and HF bias power to the workpiece and adjusting the average value and population distribution of ion energy at the surface of the workpiece by adjusting the proportion between the LF and HF bias powers.