Patent · US Active

Semiconductor wafer and process for its production

US7785706B2 · kind B2 · utility

13Cited by
8References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 26, 2008
Grant dateAug 31, 2010
Priority date
Expiry dateMay 23, 2028

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/26
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A layered semiconductor wafer contains the following layers in the given order:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.