Semiconductor wafer and process for its production
US7785706B2 · kind B2 · utility
13Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2008 |
| Grant date | Aug 31, 2010 |
| Priority date | — |
| Expiry date | May 23, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/26
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A layered semiconductor wafer contains the following layers in the given order:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.