Method for high-resolution processing of thin layers using electron beams
US7786403B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2004 |
| Grant date | Aug 31, 2010 |
| Priority date | — |
| Expiry date | Jan 22, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31744
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for etching a chromium layer in a vacuum chamber which may comprise introducing a halogen compound into the vacuum chamber, directing an electron beam onto the area of the chromium layer to be etched and/or introducing an oxygen including compound into the vacuum chamber. A further method for the highly resolved removal of a layer out of metal and/or metal oxide which may be arranged on an isolator or a substrate having poor thermal conductivity, may comprise arranging the layer inside a vacuum chamber, bombarding the layer with a focused electron beam with an energy of 3-30 keV, wherein the electron beam may be guided such that the energy transfer per time and area causes a localized heating of the layer above its melting and/or vaporization point and wherein the removal of the layer may be performed without the supply of reaction gases into the vacuum chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.