Apparatus for crack prevention in integrated circuit packages
US7786579B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2007 |
| Grant date | Aug 31, 2010 |
| Priority date | — |
| Expiry date | Jul 31, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09718
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic package having integrated circuits is provided. The microelectronic package includes multiple dielectric laminate layers, copper circuitry between the dielectric laminate layers where the copper circuitry includes circuit traces, and ball grid arrays/land grid arrays operatively connected to the copper circuitry such that conduction occurs. Further, proximate to the connection of the copper circuitry and the ball grid arrays/land grid arrays, a protective copper tongue is below an extension of the circuit traces, such that the protective copper tongue prevents the circuit traces from being affected by cracking propagated in the dielectric laminate layers or the ball grid arrays/land grid arrays.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.